Our experience in electronic material has50moreYears, we in the development of new electronic application solution combines multiple technologies, to help customers solve the problem.
We focus on the development of world class, applied to various occasions of thermal management materials, potting and encapsulation materials, caulking materials, semiconductor packaging materials, adhesives and thick film materials.Our portfolio of products and technical expertise to design a variety of chemical system, including polyurethane, acrylic acid, epoxy resin and silicone.Rich products and professional technology enables us to provide customers the best cost-effective products and solutions.
Can be customized CoolTherm products, solve the problem of electronics fever.
High thermal conductivity and low viscosity properties was used to optimize heat dissipation.
Used in semiconductor assembly at the bottom of the solid crystal glue, plastic packaging, filling glue and thermal interface material (TIM).